The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Mar. 07, 2023
Applicant:

Actron Technology Corporation, Taoyuan, TW;

Inventors:

Hsin-Chang Tsai, Taoyuan, TW;

Ching-Wen Liu, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H05K 7/20509 (2013.01);
Abstract

A heat dissipation structure includes a substrate and an annular groove. The substrate has an upper surface and a lower surface opposite to each other. The annular groove is configured on the upper surface of the substrate to divide the substrate into a configuration area and a periphery area. The annular groove is located between the configuration area and the periphery area. A depth of the annular groove is less than or equal to half of a thickness of the substrate.


Find Patent Forward Citations

Tsai, Hsin-Chang. (2026). Heat dissipation structure and power module (U.S. Patent No. 12532440). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532440

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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