The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Mar. 24, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Yang Jiao, Chandler, AZ (US);
Kyle Davidson, Hillsboro, OR (US);
Srinivasa Aravamudhan, Portland, OR (US);
Jerry T. Harris, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); C08J 5/24 (2006.01); C08K 5/56 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 5/56 (2013.01); H05K 1/0366 (2013.01); H05K 1/181 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10378 (2013.01);
Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a printed circuit board (PCB), where the PCB comprises a glass weave, a resin, and metal organic frameworks (MOFs) disposed within the resin. In an embodiment, a package substrate is coupled to the PCB, and a die is coupled to the package substrate.
Jiao, Yang. (2026). Metal organic frameworks (mofs) filler for enabling low cte and low dielectric constant pcb (U.S. Patent No. 12532412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532412
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile