The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Mar. 11, 2021
Applicant:

Shanghai Energy New Materials Technology Co., Ltd., Shanghai, CN;

Inventors:

Alex Cheng, Shanghai, CN;

Bin Chen, Shanghai, CN;

Xiaoming Wang, Shanghai, CN;

Hui Wang, Shanghai, CN;

Shaobo Yu, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/129 (2021.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); H01M 50/105 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/133 (2021.01);
U.S. Cl.
CPC ...
H01M 50/129 (2021.01); B32B 7/12 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/32 (2013.01); H01M 50/105 (2021.01); H01M 50/119 (2021.01); H01M 50/121 (2021.01); H01M 50/133 (2021.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 27/08 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2264/1052 (2020.08); B32B 2264/303 (2020.08); B32B 2307/518 (2013.01); B32B 2307/714 (2013.01); B32B 2307/732 (2013.01); B32B 2457/10 (2013.01); B32B 2553/00 (2013.01);
Abstract

An outer packaging material for a battery apparatus, the material comprising a base layer (), a bonding layer (), a barrier layer (), another bonding layer (), and a hot-melt adhesive layer (); the bonding layer () is disposed between the base layer () and the barrier layer (); the other bonding layer () is disposed between the barrier layer () and the hot-melt adhesive layer (); the barrier layer () is composed of a single layer or multiple layers of aluminum alloy foil; the aluminum alloy foil composition and the mass percentage thereof comprises over 1.2% Fe content and over 1% Mg content; after undergoing annealing treatment, a large amount of Mg will precipitate out from within the aluminum foil, and the ratio of the precipitated Mg amount to a precipitated Al amount is between 2-4.


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