The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Mar. 24, 2022
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Nanako Tamari, Tokyo, JP;

Masahiro Sumiya, Tokyo, JP;

Akira Kagoshima, Tokyo, JP;

Satoru Matsukura, Tokyo, JP;

Yuji Nagatani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 23/02 (2006.01); G05B 19/048 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
G05B 23/0283 (2013.01); G05B 19/048 (2013.01); G05B 23/024 (2013.01); H01L 21/67253 (2013.01); G05B 2219/45031 (2013.01);
Abstract

An apparatus diagnostic system for diagnosing conditions of a semiconductor manufacturing apparatus includes an apparatus diagnostic apparatus that outputs soundness indicators by a first algorithm with sensor data collected from the semiconductor manufacturing apparatus as an input to the first algorithm, outputs threshold spatial data under normal conditions of the semiconductor manufacturing apparatus by a second algorithm with the soundness indicators as an input to the second algorithm, and diagnoses conditions of the semiconductor manufacturing apparatus by a third algorithm with the soundness indicators and the threshold spatial data as an input to the third algorithm. The soundness indicators are indicators concerning a degree of soundness of conditions of the semiconductor manufacturing apparatus.


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