The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Nov. 30, 2021
Intel Corporation, Santa Clara, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment, photonics die includes one or more opto-electronic elements to receive optical signals and generate electrical signals based on the optical signals and a plurality of v-grooves in a surface of the photonics die and at an edge of the die. Each v-groove is to interface with a fiber optic cable and align the fiber optic cable with an optical interconnect to optically couple the fiber optic cable with the opto-electronic elements. The photonics die also includes a plurality of bonding pads on the surface of the photonics die and electrically connected to the one or more opto-electronic elements, and a plurality of metal bumps coupled to respective bonding pads. The photonics die further includes a barrier formation between the metal bumps and the plurality of v-grooves, e.g., to prevent the overflow of underfill into the v-groove region of the photonics die.