The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

May. 10, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Shailendra Singh Chauhan, Bengaluru, IN;

Raghavendra Rao, Bangalore, IN;

Ranjul Balakrishnan, Bangalore, IN;

Nizamuddin Shaik, Portland, OR (US);

Bijendra Singh, Bangalore, IN;

Siva Prasad Jangili Ganga, Bengaluru, IN;

Dong-Ho Han, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/32 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01R 12/71 (2011.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H01R 12/58 (2011.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H05K 9/0028 (2013.01); H01L 23/32 (2013.01); H01L 23/49833 (2013.01); H01L 23/552 (2013.01); H01R 12/714 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 9/0015 (2013.01); H01L 23/49816 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01R 12/58 (2013.01); H01R 12/7047 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10734 (2013.01); H05K 2201/10939 (2013.01);
Abstract

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.


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