The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Mar. 30, 2022
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Guilian Gao, San Jose, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
A method of processing a semiconductor element is disclosed. The method can include providing the semiconductor element that has a first nonconductive material. The first nonconductive material is disposed on a device portion of the semiconductor element. The method can include providing a transparent carrier. The method can include providing an intervening structure that has a second nonconductive material, a photolysis layer, and an opaque layer stacked together. The method can include forming a bonded structure such that the second nonconductive material is directly bonded to the first nonconductive material or to the transparent carrier. The intervening structure is disposed between the semiconductor element and the transparent carrier. The method can include decoupling the transparent carrier from the semiconductor element by exposing the photolysis layer to light through the transparent carrier such that the light decomposes the photolysis layer.