The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Feb. 25, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jongyoun Kim, Seoul, KR;
Eungkyu Kim, Yongin-si, KR;
Inhyung Song, Cheonan-si, KR;
Hyeonseok Lee, Pyeongtaek-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 25/16 (2013.01); H01L 25/165 (2013.01); H01L 23/3185 (2013.01); H01L 23/34 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01); H01L 2224/16195 (2013.01);
Abstract
A semiconductor package includes a package substrate, a semiconductor stack on the package substrate, a passive device on the package substrate and spaced apart from the semiconductor stack, and a stiffener on the package substrate and extending around an outer side of the semiconductor stack. The stiffener includes a first step surface extends over the passive device. A width of a bottom surface of the stiffener is smaller than a width of a top surface of the stiffener.