The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Aug. 12, 2022
Renesas Electronics Corporation, Tokyo, JP;
Hiroaki Sekikawa, Tokyo, JP;
Yasutaka Nakashiba, Tokyo, JP;
Hideki Sasaki, Tokyo, JP;
Hajime Hayashimoto, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
Reliability of a semiconductor device is improved. The semiconductor device includes a clip which is electrically connected to a main-transistor source pad via a first silver paste and is connected to a lead via a second silver paste. The clip has a 'first part' with which the first silver paste is in contact, a “second part” with which the second silver paste is in contact, and a “third part” positioned between the “first part” and the “second part”. A protruding member is formed on a surface of the main-transistor source pad, and the “first part” is in contact with the protruding member.