The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
May. 27, 2022
Micron Technology, Inc., Boise, ID (US);
Kunal R. Parekh, Boise, ID (US);
Angela S. Parekh, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Semiconductor devices having nano through substrate vias (TSVs), and related systems and methods, are disclosed herein. In some embodiments, the semiconductor device includes a semiconductor substrate that has a first surface and a second surface opposite the first surface. A trench is formed in the first surface and filled with a dielectric material and a TSV extends from the first surface to the second surface within the footprint of the trench. In some embodiments, the TSV includes a conductive material that includes a first portion and a second portion. The first portion includes a first end at the first surface and a second end with a larger cross-sectional area than the first end. Similarly, the second portion includes a third end coupled to the second end and a fourth end at the second surface with a larger cross-sectional area than the third end.