The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2026
Filed:
Aug. 20, 2021
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Thierry Salvetat, Grenoble, FR;
Guillaume Berre, Grenoble, FR;
Abstract
A method for transferring a semiconductor layer from a donor substrate having a weakening plane to a receiver substrate having comprising a bonding face that has open cavities includes putting the donor substrate and the bonding face of the receiver substrate in contact, producing an assembly wherein the cavities are buried, and separating the assembly by fracture along the weakening plane. The bonding face of the receiver substrate includes, apart from the open cavities, a bonding surface that comes into contact with the donor substrate when the assembly is produced. The bonding surface includes a region devoid of cavities one dimension of which is at least 100 μm and which has a surface area of at least 1 mm, and an intercavity space that occupies from 15 to 50% of the bonding face of the receiver substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile