The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

May. 15, 2025
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Olufemi I. Dosunmu, San Jose, CA (US);

Robert Blum, Mountain View, CA (US);

Zijiao Yang, Fremont, CA (US);

Jinxin Fu, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/02 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4214 (2013.01); G02B 6/02042 (2013.01); G02B 6/02342 (2013.01); G02B 6/43 (2013.01);
Abstract

An optical interface includes a cladding layer having a plurality of inner cores and a plurality of turning elements formed therein. Each inner core the plurality of inner cores is associated with a respective turning element of the plurality of turning elements. The optical interface further includes an array of optical elements formed on the cladding layer. Each optical element of the array of optical elements is associated with a respective turning element of the plurality of turning elements.


Find Patent Forward Citations

Dosunmu, Olufemi. (2026). High bandwidth density optical interfaces for co-packaged devices including photonic integrated circuits (U.S. Patent No. 12523828). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12523828

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…