The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Aug. 12, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Robert A. Medure, Santa Clara, CA (US);

Raechel Chu-Hui Tan, San Francisco, CA (US);

Changgong Wang, San Jose, CA (US);

Yuanhong Guo, Mountain View, CA (US);

Sai Padhy, San Jose, CA (US);

Ashley M. Okada, San Jose, CA (US);

Kenneth Le, Fremont, CA (US);

Atilla Kilicarslan, Mountain View, CA (US);

Dean C. Hruzek, Cedar Park, TX (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F24F 3/167 (2021.01); F24F 11/00 (2018.01); F24F 11/49 (2018.01); F24F 11/74 (2018.01); F24F 110/40 (2018.01);
U.S. Cl.
CPC ...
F24F 3/167 (2021.01); F24F 11/0001 (2013.01); F24F 11/49 (2018.01); F24F 11/74 (2018.01); F24F 2110/40 (2018.01);
Abstract

Disclosed are implementations for minimizing substrate contamination during pressure changes in substrate processing systems. Over a duration of a pressure change (increase or decrease) in a chamber of a substrate processing system, a flow rate is adjusted multiple times to reduce occurrence of contaminant particles in an environment of the chamber. In some instances, the flow rate is changed continuously using at least one dynamic valve that enable continuous control over the pressure dynamics of the chamber.


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