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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12521977 B1

PDFFull Text
Date of Patent:
Jan. 13, 2026

Filed:

Jul. 11, 2022

Method of manufacturing semiconductor device using gas blowing agent

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Cheonil Park, Seongnam-si, KR;

Myoungchul Eum, Asan-si, KR;

Hwail Jin, Seongnam-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Brent A Fairbanks

Assistant Examiner:

Krishna J Palaniswamy

Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 3/30 (2006.01); B32B 7/12 (2006.01); B32B 37/18 (2006.01); B32B 38/10 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 3/30 (2013.01); B32B 7/12 (2013.01); B32B 37/18 (2013.01); B32B 38/10 (2013.01); H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 21/76898 (2013.01); B32B 2037/1253 (2013.01); B32B 2255/26 (2013.01); B32B 2305/022 (2013.01); B32B 2305/30 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/14 (2013.01);
Abstract

A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive film disposed on an upper surface of the base film and contacting the carrier substrate. The device adhesive film includes a gas blowing agent, and the carrier adhesive film may not include a gas blowing agent.

Find Patent Forward Citations

Quick Actions:

Park, Cheonil. (2026). Method of manufacturing semiconductor device using gas blowing agent (U.S. Patent No. 12521977). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12521977

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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