The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2026

Filed:

Oct. 11, 2022
Applicant:

SK Enpulse Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jang Won Seo, Seoul, KR;

Eun Sun Joeng, Gyeonggi-do, KR;

Sung Hoon Yun, Seoul, KR;

Jong Wook Yun, Seoul, KR;

Assignee:

Enpulse Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/22 (2012.01); B24B 37/04 (2012.01); B24B 37/24 (2012.01); B24B 37/26 (2012.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 7/02 (2019.01); B32B 27/16 (2006.01); B32B 27/40 (2006.01); H01L 21/306 (2006.01); B32B 3/30 (2006.01); B32B 7/022 (2019.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 37/042 (2013.01); B24B 37/24 (2013.01); B32B 3/26 (2013.01); B32B 7/02 (2013.01); B32B 27/16 (2013.01); B32B 27/40 (2013.01); H01L 21/30625 (2013.01); B24B 37/26 (2013.01); B32B 3/30 (2013.01); B32B 5/18 (2013.01); B32B 7/022 (2019.01); B32B 2305/72 (2013.01); B32B 2375/00 (2013.01); H01L 21/67092 (2013.01); Y10T 428/24504 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24983 (2015.01);
Abstract

The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, it includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface.


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