The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Jun. 27, 2023
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Akimasa Kinoshita, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/832 (2025.01); H10D 8/01 (2025.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01); H10D 62/13 (2025.01);
U.S. Cl.
CPC ...
H10D 62/8325 (2025.01); H10D 8/021 (2025.01); H10D 30/668 (2025.01); H10D 62/127 (2025.01); H10D 62/157 (2025.01);
Abstract

A silicon carbide semiconductor device has a silicon carbide semiconductor substrate of a first conductivity type; a first semiconductor layer of the first conductivity type; a second semiconductor layer of a second conductivity type; first semiconductor regions of the first conductivity type; trenches; gate insulating films; gate electrodes; first high-concentration regions of the second conductivity type provided at positions facing the trenches in a depth direction; second high-concentration regions of the second conductivity type, selectively provided between the trenches and in contact with the first semiconductor regions, each having an upper surface exposed at the surface of the second semiconductor layer and a lower surface partially in contact with upper surfaces of the first high-concentration regions; a first electrode; and a second electrode. The second high-concentration regions are disposed periodically in a longitudinal direction of the trenches.


Find Patent Forward Citations

Kinoshita, Akimasa. (2026). Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device (U.S. Patent No. 12520551). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12520551

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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