The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Mar. 03, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Han-Jong Chia, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Semiconductor devices are provided. First and second dies are vertically stacked. The first die includes a plurality of memory cells and a plurality of first and second connection features. The memory cells are arranged in rows and columns of a memory array. The first connection features are electrically connected to a plurality of word lines of the memory array. The second connection features are electrically connected to a plurality of bit lines of the memory array. Each third connection feature of the second die is electrically connected to a respective first connection feature. Each word line driver of the second die is electrically connected to a respective third connection feature. Each fourth connection feature of the second die is electrically connected to a respective second connection feature of the first die. Each sense amplifier of the second die is electrically connected to a respective fourth connection feature.