The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12518973 B1

Date of Patent:

Jan. 06, 2026

Filed:

Mar. 01, 2023

Wafer processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Masaru Nakamura, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer, Burns & Crain, Ltd

Primary Examiner:

Mohsen Ahmadi

Int. Cl.

CPC ...

H01L 21/304 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/77 (2017.01); H01L 21/78 (2006.01);

U.S. Cl.

CPC ...

H01L 21/304 (2013.01); H01L 21/78 (2013.01);

Abstract

Provided is a wafer processing method including a back surface film processing step of removing or roughening a back surface film that is applied to the back surface of the wafer, a protective member providing step of providing a protective member to a front surface of the wafer before or after the back surface film processing step is carried out, and a back surface grinding step of holding the protective member side on a chuck table and grinding the back surface of the wafer with grinding stones to thin the back surface of the wafer to a desired thickness.

Find Patent Forward Citations

Nakamura, Masaru. (2026). Wafer processing method (U.S. Patent No. 12518973). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12518973

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