The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2026

Filed:

Apr. 05, 2024
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Yang Lu, Boise, ID (US);

Kang-Yong Kim, Boise, ID (US);

Wonjun Choi, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/06 (2006.01);
U.S. Cl.
CPC ...
G11C 7/06 (2013.01); G11C 2207/06 (2013.01);
Abstract

Apparatuses and techniques for implementing a data sense amplifier circuit with a hybrid architecture. With the hybrid architecture, the data sense amplifier circuit includes a first set of amplifiers that are shared by multiple banks and includes a second set of amplifiers with multiple subsets dedicated to different banks. The bank-shared amplifiers support memory operations (e.g., a read operation) across multiple banks. Each amplifier within the first set of amplifiers is coupled to at least two banks. The bank-specific amplifiers support usage-based disturbance mitigation for a corresponding bank. Each amplifier within the second set of amplifiers is coupled to one of the multiple banks. The bank-shared amplifiers enable the data sense amplifier circuit to have a smaller footprint while the bank-specific amplifiers enable the data sense amplifier circuit to support usage-based disturbance mitigation and avoid conflicts associated with some sequences of commands.


Find Patent Forward Citations

Quick Actions:

Lu, Yang. (2026). Data sense amplifier circuit with a hybrid architecture (U.S. Patent No. 12518803). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12518803

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