The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Mar. 07, 2025
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Gaius Gillman Fountain, Jr., Youngsville, NC (US);
Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US);
Abstract
Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, an integrated cooling assembly includes a semiconductor device and a cold plate attached to a backside of the semiconductor device. The cold plate includes an upper portion disposed vertically adjacent to the backside of the semiconductor device and a lower portion disposed between the upper portion of the cold plate and the backside of the semiconductor device. The upper portion includes upper coolant channels defined by upper cavity sidewalls. The lower portion includes lower coolant channels defined by lower cavity sidewalls. The upper cavity sidewalls extend downwardly into regions between adjacent lower coolant channels. The lower cavity sidewalls extend upwardly into regions between adjacent upper coolant channels.