The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Nov. 14, 2022
Nxp Usa, Inc., Austin, TX (US);
Kevin Kim, Chandler, AZ (US);
Vikas Shilimkar, Chandler, AZ (US);
Joseph Gerard Schultz, Wheaton, IL (US);
NXP USA, INC., Austin, TX (US);
Abstract
A power amplifier device includes a transistor die with an elongated bondpad coupled to a terminal of an integrated transistor. The device also includes a substrate formed from a stack of alternating dielectric and patterned conductive layers. An elongated die contact is exposed at a first substrate surface and is attached to the elongated bondpad to provide a uniform connection between the die contact and the elongated bondpad. A vertical interconnect structure is connected to the die contact and extends towards the second substrate surface. A circuit includes passive component(s) coupled to the second substrate surface and to the vertical interconnect structure. An encapsulation material layer covers the passive component(s) and the second substrate surface. A plurality of device interconnects are coupled to the substrate, electrically coupled to the power transistor die, and exposed at a contact surface of the power amplifier device.