The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Feb. 17, 2023
Applicant:

Air Products and Chemicals, Inc., Allentown, PA (US);

Inventors:

Liang Wu, Shanghai, CN;

Wenshan Pang, Shanghai, CN;

Lulu Qi, Shanghai, CN;

Xiang Yu, Shanghai, CN;

Leijian Yu, Shanghai, CN;

Jiong Chen, Shanghai, CN;

Gregory Khosrov Arslanian, Pipersville, PA (US);

Yuxiang Zhou, Shanghai, CN;

Assignee:

Air Products and Chemicals, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/742 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/117 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/742 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/81022 (2013.01); H01L 2224/81211 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81908 (2013.01); H01L 2924/40 (2013.01);
Abstract

The present invention relates to an apparatus and method for wafer oxide removal and reflow treatment. In particular, the present invention relates to an apparatus for wafer oxide removal and reflow treatment, comprising: a heating plate, a sample plate for supporting a wafer sample above the heating plate, and an electron attachment pin plate above the sample plate, wherein the heating plate is configured to be capable of moving up and down, and contacting and heating the sample plate.


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