The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Apr. 20, 2023
Qualcomm Incorporated, San Diego, CA (US);
Xia Li, San Diego, CA (US);
John Holmes, Escondido, CA (US);
Aniket Patil, San Diego, CA (US);
Bin Yang, San Diego, CA (US);
QUALCOMM INCORPORATED, San Diego, CA (US);
Abstract
Substrate with multiple core layers to provide varied thickness cavities supporting varied thickness embedded electrical devices, and related integrated circuit (IC) packages and fabrication methods. To provide for core layer of the substrate to support multiple embedded electrical devices, multiple core layers are provided in the substrate. Providing multiple core layers in the substrate allows multiple cavities to be formed in the core layers at multiple depths to compatibly support embedding of multiple electrical devices of varied thicknesses in the core layers. Thus, providing multiple core layers in the substrate can compatibly support forming cavities of multiple thicknesses that are compatible with multiple electrical devices of different thicknesses to be embedded therein. In this manner, design parameters of the overall thickness of the core layer of a substrate can be independent of the variation in thicknesses of multiple embedded electrical devices desired to be embedded therein.