The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Jul. 17, 2023
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Chih-Feng Lin, Hsinchu, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/00 (2006.01); G11C 11/406 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 25/18 (2023.01); H10B 80/00 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G11C 11/40626 (2013.01); H01L 23/34 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 25/18 (2013.01); H10B 80/00 (2023.02); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/17181 (2013.01);
Abstract
A 3-dimensional (3D) integrated circuit (IC) is provided. The 3D IC includes a plurality of chips, at least one through silicon via (TSV) structure, and a temperature sensor. The chips are stacked in the 3D IC. The TSV structure penetrates the chips. The temperature sensor is disposed in a first chip of the chips. The temperature sensor is disposed close to the TSV structure, and is configure to sense a temperature sensing result corresponding to a temperature of the TSV structure.