The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Mar. 10, 2022
Applicant:

Dongwoo Fine-chem Co., Ltd., Jeollabuk-do, KR;

Inventors:

Soon-Hong Pang, Jeollabuk-do, KR;

Han-Byeol Kang, Gyeonggi-do, KR;

Sung-Sik Kim, Jeollabuk-do, KR;

Tae-Hee Kim, Jeollabuk-do, KR;

Assignee:

DONGWOO FINE-CHEM CO., LTD., Jelloabuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C11D 3/43 (2006.01); C09D 9/00 (2006.01); C11D 3/24 (2006.01); C11D 3/28 (2006.01); C11D 3/30 (2006.01); G03F 7/42 (2006.01);
U.S. Cl.
CPC ...
C09D 9/005 (2013.01); C11D 3/245 (2013.01); C11D 3/28 (2013.01); C11D 3/30 (2013.01); G03F 7/425 (2013.01); C11D 2111/22 (2024.01);
Abstract

The present disclosure relates to a process solution composition for polymer treatment comprising: a fluorine compound; a ketone-based solvent; and a polar aprotic solvent, wherein the ketone-based solvent is one or more selected from the group consisting of compounds represented by Chemical Formula 1 or Chemical Formula 2, and has an effect capable of preventing damage to various types of metals while improving the power of removing an adhesive polymer remaining on the wafer circuit surface in a semiconductor manufacturing process.


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