The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jun. 24, 2021
Intel Corporation, Santa Clara, CA (US);
Zhen Zhou, Chandler, AZ (US);
Tae Young Yang, Portland, OR (US);
Shuhei Yamada, Hillsboro, OR (US);
Tolga Acikalin, San Jose, CA (US);
Johanny Escobar Pelaez, Jalisco, MX;
Kenneth Foust, Beaverton, OR (US);
Jason Mix, Portland, OR (US);
Renzhi Liu, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.