The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Jan. 21, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chun Yu Chen, Hsinchu, TW;
Yen Lian Lai, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a substrate and a first interconnect layer over the substrate. The first interconnect layer includes a first device region and a first ring region surrounding the first device region. The first ring region includes a first wall fully surrounding the first device region and a second wall fully surrounding the first device region and the first wall. The first wall is spaced apart from the second wall by a first intermetal dielectric layer and at least one first dummy metal line along an edge of the first device region. The first wall is spaced apart from the second wall only by the first intermetal dielectric layer around a corner of the first device region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile