The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2025
Filed:
Feb. 09, 2022
Nxp Usa, Inc., Austin, TX (US);
Roy Mclaren, Gilbert, AZ (US);
Joseph Agyemang Duah, Gilbert, AZ (US);
Ramanujam Srinidhi Embar, Gilbert, AZ (US);
NXP USA, Inc., Austin, TX (US);
Abstract
Embodiments of a microelectronic package include a package body, radio frequency (RF) circuitry contained in the package body, and a topside input/output (I/O) interface formed on an exterior surface of the package body, and a coaxially-shielded RF interposer. The first coaxially-shielded RF interposer includes a dielectric interposer body, a first signal-carrying via electrically coupled to a topside signal terminal included in the topside I/O interface, and a first coaxial shield structure. The first coaxial shield structure is bonded to the dielectric interposer body, is electrically coupled to a first topside ground terminal further included in the topside I/O interface, and extends at least at least partially around an outer periphery of the signal-carrying via.