The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Jul. 28, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Tamir Salus, Zichron Taakov, IL;

Christopher Schaef, Hillsboro, OR (US);

Alex Lyakhov, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05F 1/56 (2006.01); H02M 3/158 (2006.01);
U.S. Cl.
CPC ...
G05F 1/56 (2013.01); H02M 3/158 (2013.01);
Abstract

A microelectronic assembly is disclosed, comprising a first integrated circuit (IC) die having electrical load circuits, first control circuits, and a second control circuit, a second IC die having powertrain (PTR) phase circuits electrically coupled to the first IC die, and inductors in a package substrate electrically coupled to the first IC die and the second IC die within a package. Individual ones of the first control circuits regulates power to a corresponding one of the electrical load circuits. The second control circuit maps the first control circuits and the PTR phase circuits. The PTR phase circuits control power to the inductors. The first control circuits, the second control circuit, the PTR phase circuits and the inductors together function as a voltage regulator configured to receive power from the package substrate at a first voltage and deliver power to the electrical load circuits at a second voltage.


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