The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Feb. 25, 2022
Applicant:

Siltronic Ag, Munich, DE;

Inventors:

Hannes Hecht, Burghausen, DE;

Michael Lauer, Burghausen, DE;

Korbinian Lichtenegger, Munich, DE;

Walter Edmaier, Wittibreut, DE;

Assignee:

SILTRONIC AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 25/08 (2006.01); C23C 16/44 (2006.01); C30B 25/16 (2006.01); H01L 21/02 (2006.01); C23C 16/24 (2006.01); C30B 25/20 (2006.01); C30B 29/06 (2006.01);
U.S. Cl.
CPC ...
C30B 25/08 (2013.01); C23C 16/4408 (2013.01); C30B 25/165 (2013.01); H01L 21/0262 (2013.01); C23C 16/24 (2013.01); C30B 25/20 (2013.01); C30B 29/06 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/0254 (2013.01);
Abstract

A method produces semiconductor wafers in a chamber of a deposition reactor of a plant. The method includes: repeatedly depositing an epitaxial layer on a substrate wafer in the chamber, producing semiconductor wafers, and at the same time: conditioning a replacement chamber outside the plant by purging the replacement chamber with a purge gas; interrupting the deposition of the epitaxial layer; replacing the chamber with the replacement chamber, after the conditioning, the replacement chamber being sealed and transported in a closed state to the plant or after the conditioning, the replacement chamber is transported to the plant and in this process purge gas is passed through the replacement chamber; and continuing the deposition of the epitaxial layer in the replacement chamber, producing a second number of semiconductor wafers.


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