The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Dec. 15, 2022
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Saumitra Raj Mehrotra, Scottsdale, AZ (US);

Xu Cheng, Chandler, AZ (US);

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 8/25 (2025.01); H10D 8/01 (2025.01);
U.S. Cl.
CPC ...
H10D 8/25 (2025.01); H10D 8/022 (2025.01);
Abstract

Provided is a semiconductor device that includes: a semiconductor substrate having a first doped region of a first doping type and a second doped region of a second doping type, the first doped region being beneath but immediately adjacent to, the second doped region, with the first doping type being opposite the second doping type, thereby forming a junction region between the first doped region and the second doped region; and an additional layer that has been deposited above the junction region having similar mechanical properties as the semiconductor substrate. The additional layer covers at least 50% of a projection area of the junction region. The second doped region has a top surface, the additional layer has a bottom surface, and at least 90% of the bottom surface of the additional layer is electrically insulated from the top surface of the second doped region.


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