The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Mar. 14, 2023
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Jeff Ku, Taipei, TW;
Baomin Liu, Hillsboro, OR (US);
Cora Nien, Taipei, TW;
Min Suet Lim, Gelugor, MY;
Tongyan Zhai, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); F16K 31/50 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); F16K 31/504 (2013.01); H05K 7/20254 (2013.01); H05K 2201/0209 (2013.01);
Abstract
Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.