The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Jul. 14, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Wen Wei Lum, Singapore, SG;

Kelvin Aik Boo Tan, Singapore, SG;

Alaa N. Ali, San Jose, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H01L 23/642 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H10D 1/692 (2025.01);
Abstract

Implementations described herein relate to various apparatuses and integrated assemblies. In some implementations, an apparatus may include a substrate having a first surface and a second surface that is on an opposite side of the substrate with respect to the first surface. The apparatus may include an integrated circuit disposed on the substrate. The apparatus may include a decoupling capacitor configured to stabilize an input voltage supplied to the integrated circuit, wherein all electrodes of the decoupling capacitor are entirely within a region between the first surface and the second surface.


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