The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Apr. 28, 2022
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Tomohiro Kano, Tokyo, JP;

Kenji Takenouchi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/38 (2014.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 21/304 (2006.01); H01L 21/306 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/38 (2013.01); H01L 21/561 (2013.01); H01L 21/67086 (2013.01); H01L 21/67092 (2013.01); H01L 21/3043 (2013.01); H01L 21/30604 (2013.01); H01L 24/97 (2013.01); H01L 2221/68331 (2013.01); H01L 2224/97 (2013.01);
Abstract

Provided is a method for processing a substrate having a metal formed on a planned dividing line along the planned dividing line, the method including a processed groove forming step of forming a processed groove in the substrate along the planned dividing line, and a burr removing step of, after the processed groove forming step is performed, making an etchant that includes at least an oxidizing agent and to which an ultrasonic vibration is imparted come into contact with the substrate, suppressing ductility of a metallic burr generated on a periphery of the formed processed groove and increasing fragility of the burr by modifying the burr by the oxidizing agent included in the etchant, and removing the burr by the ultrasonic vibration.


Find Patent Forward Citations

Loading…