The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Mar. 14, 2023
Applicant:
Db Hitek Co., Ltd., Bucheon-si, KR;
Inventors:
Sang Il Hwang, Wonju-si, KR;
Dae Il Kim, Cheongju-si, KR;
Sung Hoon Lee, Cheongju-si, KR;
Young Joon Choi, Ansan-si, KR;
Assignee:
DB HiTek Co., Ltd., Bucheon-si, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); H10D 62/17 (2025.01);
U.S. Cl.
CPC ...
H01L 21/76229 (2013.01); H01L 21/02112 (2013.01); H01L 21/3213 (2013.01); H10D 62/393 (2025.01);
Abstract
Disclosed are a semiconductor device and a method of manufacturing the same. More particularly, a semiconductor device and a method of manufacturing the same are disclosed, including a device isolation structure with a pre-DTI structure and/or a DTI structure having at least one corner region with a cut shape/corner or truncation in a plan view, thereby reducing or preventing the occurrence of defects during formation of the device isolation structure and in a subsequent CMP process.