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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12500082 B1

PDFFull Text
Date of Patent:
Dec. 16, 2025

Filed:

May. 10, 2021

Semicondctor device package thermal conduit

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Archana Venugopal, Dallas, TX (US);

Benjamin Stassen Cook, Rockwall, TX (US);

Luigi Colombo, Dallas, TX (US);

Robert Reid Doering, Garland, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorney:

Frank D. Cimino

Primary Examiner:

Jami Valentine Miller

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02354 (2013.01); H01L 21/02288 (2013.01); H01L 21/56 (2013.01); H01L 23/3677 (2013.01); H01L 23/373 (2013.01); H01L 23/3737 (2013.01); H01L 23/4334 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/3121 (2013.01); H01L 23/34 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15313 (2013.01);
Abstract

A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the encapsulation material contacting the thermal conduit. The thermal conduit includes a cohered nanoparticle film. The cohered nanoparticle film is formed by a method which includes an additive process.

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