The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Jun. 15, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wei Lee, Hsinchu, TW;

Katherine H Chiang, New Taipei, TW;

Pei-Wen Liu, Hsinchu, TW;

Ke-Wei Su, Hsinchu County, TW;

Kuan-Lun Cheng, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/414 (2006.01);
U.S. Cl.
CPC ...
G01N 27/4145 (2013.01); G01N 27/4148 (2013.01);
Abstract

A semiconductor structure includes a sensor, a patterned dielectric layer, and a cover disposed on the patterned dielectric layer. The sensor includes a bio-sensing device and at least one voltage-reference device disposed in proximity to the bio-sensing device. The bio-sensing device includes a first field effect transistor (FET) and a first sensing portion of a sensing film capacitively coupled to the first FET, and the first sensing portion is concave toward the first FET. The at least one voltage-reference device includes a second FET and a second sensing portion of the sensing film capacitively coupled to the second FET. The patterned dielectric layer is disposed on the sensing film and includes at least one sensing well located above the at least one voltage-reference device and the bio-sensing device. The cover includes fluid channels communicating with the at least one sensing wells.


Find Patent Forward Citations

Loading…