The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Aug. 17, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Takeshi Suwa, Kawasaki Kanagawa, JP;

Tomoko Matsudai, Tokyo, JP;

Yoko Iwakaji, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/10 (2025.01); H10D 12/00 (2025.01); H10D 64/00 (2025.01);
U.S. Cl.
CPC ...
H10D 62/107 (2025.01); H10D 12/481 (2025.01); H10D 64/112 (2025.01);
Abstract

A semiconductor device includes a semiconductor part, a first electrode, first and second control electrodes. The first electrode and the first control electrode are provided in an active region. The second control electrode is provided in a termination region. The semiconductor part including first and third layers of a first conductivity type, and second and fourth layers of a second conductivity type. The first layer is provided in the active and termination regions. The second layer is provided between the first layer and the first electrode, and faces the first control electrode via a first insulating film. The third layer is provided between the second layer and the first electrode. The fourth-layers are provided on the first layer in the termination region. The first layer includes a portion extending between the fourth layers. The second control electrode faces the portion of the first layer via a second insulating film.


Find Patent Forward Citations

Loading…