The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2025

Filed:

Sep. 07, 2022
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventors:

Mengmeng Yang, Hefei, CN;

Yi Tang, Hefei, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01);
U.S. Cl.
CPC ...
H10B 12/30 (2023.02); H10B 12/03 (2023.02); H10B 12/05 (2023.02); H10B 12/482 (2023.02); H10B 12/488 (2023.02);
Abstract

Provide is a method for manufacturing a semiconductor structure, a semiconductor structure, and a semiconductor memory. The method includes the following operations. A substrate is provided. Multiple silicon pillars are formed in the substrate, and extend along a first direction. In the first direction, each of the silicon pillars includes a first portion and a second portion. An insulating layer is formed in the second portion of the silicon pillar. A conductive layer is formed in the first portion of the silicon pillar. A capacitor layer is formed on surfaces of the insulating layer and the conductive layer of the silicon pillar.


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