The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Jan. 14, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Hsiang-Wei Liu, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 30/392 (2020.01); H01L 23/525 (2006.01); H10B 20/20 (2023.01); H10B 20/25 (2023.01);
U.S. Cl.
CPC ...
G06F 30/392 (2020.01); H01L 23/5256 (2013.01); H10B 20/20 (2023.02); H10B 20/25 (2023.02);
Abstract
An integrated circuit (IC) device includes a transistor and a metal fuse structure including a metal fuse electrically connected to the transistor, and a first metal line in parallel with the metal fuse and adjacent to a first portion of the metal fuse in a first direction. The first portion has a first width, and the metal fuse includes a second portion having a second width larger than the first width, and a first contour between the first and second portions and aligned with a first end of the first metal line.