The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Feb. 22, 2023
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Suresh Reddy Yarragunta, Bangalore, IN;
Deepu Narasimiah Subhash, Bangalore, IN;
Ravi Kumar Kollipara, Telangana, IN;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); G06F 1/20 (2013.01); H05K 7/20254 (2013.01); H05K 7/20281 (2013.01);
Abstract
A method includes a liquid cooling manifold cooling a processor component of a system by liquid cooling a first cold plate coupled to the processor component, cooling a memory component of the system by liquid cooling the first cold plate coupled to the memory component, and a liquid cooling a drive component of the system by liquid cooling a second cold plate coupled to the drive component.
Yarragunta, Suresh. (2025). Liquid cooling manifold (U.S. Patent No. 12490407). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12490407
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile