The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Aug. 23, 2022
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Hideto Furuyama, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32057 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13056 (2013.01);
Abstract

A distance between outermost parts of alignment chips in a direction normal to a surface of a substrate is different between a first direction and a second direction along terminal placement surfaces. The plurality of alignment chips include a first alignment chip fixed to a first metal pad, and a second alignment chip fixed to a second metal pad. The first alignment chip and the second alignment chip are oriented in different directions on the surface of the substrate. A semiconductor module includes a first side surface part extending in the second direction and facing the first alignment chip, and a groove part formed in a portion of the first side surface part. A portion of the second alignment chip is positioned in the groove part.


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