The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
May. 04, 2023
Disco Corporation, Tokyo, JP;
Kentaro Odanaka, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A method of processing a wafer includes removing a functional layer on projected dicing lines, thereby exposing a substrate, and cutting the wafer along the projected dicing lines where the substrate is exposed, thereby fabricating individual device chips. A laser applying apparatus includes a beam branching unit for branching a laser beam spot into at least two slender spots spaced from each other in a processing direction along the projected dicing lines, and orienting longer sides of the slender spots transversely across the projected dicing lines and shorter sides of the slender spots in the processing direction. A wafer region processed by the laser beams is expanded by moving the at least two slender spots from the beam branching unit in such a manner as to make the longer sides of the slender spots shifted in opposite directions transversely across the projected dicing lines.