The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
May. 27, 2022
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Tadashi Enomoto, Iwate, JP;
Tsutomu Sugawara, Iwate, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 1/14 (2021.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); G01K 13/024 (2021.01); H05B 1/02 (2006.01);
U.S. Cl.
CPC ...
G01K 1/14 (2013.01); G01K 13/024 (2021.01); H05B 1/0233 (2013.01); C23C 16/4557 (2013.01); C23C 16/52 (2013.01);
Abstract
A semiconductor manufacturing apparatus includes: a gas introduction pipe connected to a processing container of the semiconductor manufacturing apparatus in order to introduce a gas into the processing container; and a temperature sensor provided in the gas introduction pipe in order to measure a temperature of a gas in the gas introduction pipe.