The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Feb. 28, 2022
Kioxia Corporation, Tokyo, JP;
Susumu Yamamoto, Yokkaichi Mie, JP;
Tsutomu Fujita, Yokkaichi Mie, JP;
Takeori Maeda, Mie Mie, JP;
Satoshi Hongo, Yokkaichi Mie, JP;
Gen Toyota, Yokkaichi Mie, JP;
Eiichi Shin, Yokkaichi Mie, JP;
Yukio Katamura, Mie Mie, JP;
Kioxia Corporation, Tokyo, JP;
Abstract
According to one embodiment, a method of manufacturing a semiconductor device includes forming a plurality of stacked bodies on a substrate, each of the stacked bodies includes a plurality of semiconductor chips. The method further includes forming a plurality of first wires on the stacked bodies. The first wires connecting the stacked bodies to each other. The method further includes forming a resin layer on the stacked bodies and the first wires, then thinning he resin layer until the first wires are exposed.