The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Dec. 21, 2021
Intel Corporation, Santa Clara, CA (US);
Eleanor Patricia Paras Rabadam, Folsom, CA (US);
Guiyun Bai, Chandler, AZ (US);
Israel Petronius, Haifa, IL;
Sushrutha Gujjula, Chandler, AZ (US);
Ronald L. Spreitzer, Phoenix, AZ (US);
Kenneth Brown, Tempe, AZ (US);
Konstantin Matyuch, Netanya, IL;
Boping Xie, San Ramon, CA (US);
Stephen Keele, New Holland, PA (US);
Qifeng Wu, Hillsboro, OR (US);
Ankur Agrawal, Chandler, AZ (US);
Jonathan Doylend, Morgan Hill, CA (US);
Sanjeev Gupta, Santa Rosa, CA (US);
Sam Khalili, San Jose, CA (US);
Daniel Grodensky, Haifa, IL;
Nan Kong Ng, Kulim, MY;
Ron Friedman, Givat Oz, IL;
Gal Dvoretzki, Hod Hasharon, IL;
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are light detection and ranging (LIDAR) systems and methods for manufacturing the same. The LIDAR systems may include microelectronics packages that may include a chassis, an insert, a photonic integrated circuit (PIC), and a lid. The chassis may define an opening. The insert is sized to be received in the opening. The insert is made of a thermally conductive material. The PIC is attached to the insert. The lid is connected to the chassis and defines a cavity that encases the PIC. Both the insert and the lid form thermally conductive pathways away from the PIC.