The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Jan. 17, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Yuji Mimura, Albany, NY (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/85 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G01N 21/85 (2013.01); H01L 21/6835 (2013.01); G01N 2021/8578 (2013.01);
Abstract

An analysis apparatus according to an aspect of the present disclosure includes a substrate holding unit, an insertion unit, and a gas analysis unit. The substrate holding unit holds a bonded substrate where a first substrate and a second substrate are bonded. The insertion unit is capable of being inserted between a bonding surface of the first substrate and a bonding surface of the second substrate in the bonded substrate that is held by the substrate holding unit. The gas analysis unit analyzes a component(s) of a gas or gasses that is/are jetted from between a bonding surface of the first substrate and a bonding surface of the second substrate.


Find Patent Forward Citations

Mimura, Yuji. (2025). Analysis apparatus, bonding system, and analysis method (U.S. Patent No. 12480884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12480884

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…