The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Apr. 22, 2022
Tokyo Electron Limited, Tokyo, JP;
Nathan Ip, Austin, TX (US);
Nima Nejadsadeghi, Dallas, TX (US);
Tokyo Electron Limited, Tokyo, JP;
Abstract
A wafer bonding apparatus including: a first chuck in a processing chamber, the first chuck being configured to hold a first wafer, the first chuck including: a chuck body, and a tunable stiffness layer including a plurality of actuators, the plurality of actuators including a tunable stiffness material, the tunable stiffness layer being disposed below the chuck body; a controller configured to send control signals to one or more of the plurality of actuators; and a vacuum line on the chuck body configured to apply a vacuum pressure from a vacuum pump to the first wafer; and a second chuck in the processing chamber, the second chuck being configured to hold a second wafer to be bonded with the first wafer; and where a stiffness of the plurality of actuators is configured to change based on the control signals from the controller.