The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Apr. 28, 2023
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chia-Lin Hsu, Hsinchu, TW;

Yu-Ti Su, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/00 (2025.01); H10D 62/13 (2025.01); H10D 84/80 (2025.01); H10D 84/85 (2025.01); H10D 89/60 (2025.01);
U.S. Cl.
CPC ...
H10D 89/611 (2025.01); H10D 62/152 (2025.01); H10D 62/156 (2025.01); H10D 84/811 (2025.01); H10D 84/853 (2025.01); H10D 84/856 (2025.01);
Abstract

An IC device includes first and second CMOS structures positioned in n-type doped regions of a substrate, the first CMOS structure including a common gate terminal, first NMOS body and source contacts, and first PMOS body and source contacts, the second CMOS structure including a common drain terminal, second NMOS body and source contacts, and second PMOS body and source contacts. The IC device includes a first electrical connection from the common drain terminal to the common gate terminal, a clamp device including a diode, a second electrical connection from a cathode of the diode to the first PMOS body and source contacts, and a third electrical connection from an anode of the of the diode to the first NMOS body and source contacts, and entireties of each of the second and third electrical connections are positioned between the substrate and a third metal layer of the IC device.


Find Patent Forward Citations

Hsu, Chia-Lin. (2025). Integrated circuit protection device and method (U.S. Patent No. 12477835). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12477835

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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