The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Jun. 13, 2022
Applicants:

Advantest Corporation, Tokyo, JP;

Tokyo Institute of Technology, Tokyo, JP;

Inventors:

Shinji Sugatani, Saitama, JP;

Takayuki Ohba, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/60 (2013.01);
Abstract

Provided is a stacked device comprising: a plurality of circuit layers each having a circuit portion; an insulating layer configured to cover a plurality of circuit portions included in a part of circuit layers of the plurality of circuit layers, and a plurality of conductive vias provided in the insulating layer and electrically connected to the plurality of circuit portions, wherein the conductive via electrically connected to a partial circuit portion of the plurality of circuit portions is electrically insulated on an end surface on an opposite side to the plurality of circuit portions and the partial circuit portion is broken at least partially along a stacking direction.


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